TECNO Teases Ultra-Thin, Modular Marvel at MWC Barcelona

Chinese technology company TECNO has unveiled a striking modular smartphone concept design at the Mobile World Congress (MWC) in Barcelona. The phone’s core unit measures just 4.9 millimeters in thickness—thinner than a pencil and slimmer than the recently announced iPhone Air, according to Engadget.

TECNO’s newly developed interconnection technology incorporates magnets and pin connectors. The magnets enable users to attach various components seamlessly, while the pin connectors ensure power delivery. Data transmission between the phone and modules will occur wirelessly, with the device capable of switching between Wi-Fi, Bluetooth, and mmWave technologies depending on positioning.

The company has developed 10 different modules for the device. These include various types of camera lenses and a dedicated gaming controller. When a power bank module is attached, the phone’s thickness becomes comparable to that of current smartphones.

TECNO stated that the phone has been designed “to grow with the user through hardware expansion.” Two colorways have been introduced for the phone and its accessories—Silver Aluminum and Gray versions.

However, the device remains a concept design. While its chances of commercial release appear limited, analysts believe that TECNO’s magnetic attachment technology could feature in future real-world products.

TECNO has previously introduced innovative designs, including affordable foldable phones, pop-out portrait lenses, and external circular displays. Although modular smartphone concepts such as Project Ara were introduced nearly a decade ago, modular smartphones have yet to achieve commercial success. In 2016, LG G5 and certain semi-modular phones from Motorola entered the market but failed to generate widespread response.

DBTech/BMT/OR