Huawei Maps Out Bold AI Chip Roadmap
Chinese tech giant Huawei has, for the first time, unveiled its progress and plans in chipmaking, announcing that it will release four new versions of its Ascend AI chips over the next three years, according to Reuters.
Following the launch of the Ascend 910C in the first quarter of this year, the company’s Vice Chairman Eric Xu revealed that two versions of the Ascend 950 will arrive next year. The Ascend 960 is scheduled for release in 2027, followed by the Ascend 970 in 2028.
He stated, “Computing power has always been important for artificial intelligence, and for China, it is even more critical.” The Ascend 950 will feature Huawei’s own high-bandwidth memory, which until now had relied on suppliers from South Korea and the United States.
In addition, Huawei will introduce new computing power supernodes — the Atlas 950 and Atlas 960 — capable of supporting 8,192 and 15,488 Ascend chips respectively.
Research firm SemiAnalysis reported that in certain aspects, Huawei’s technology surpasses even Nvidia’s GB200 NVL72.
