BSIA Holds Second Annual General Meeting
BSIA Sets 2030 Chip Roadmap Goal
- Association prioritizes high-end chip design, workforce training, and international research collaborations
- Members recommend formulating comprehensive Semiconductor Industry Roadmap 2030 for government submission
- Five operational agendas, audited financial accounts, and fiscal reports were formally adopted
The Bangladesh Semiconductor Industry Association (BSIA) plans to develop a comprehensive semiconductor industry roadmap toward 2030 to strengthen Bangladesh’s position in the global chip industry. The association is prioritizing skilled workforce development, research and innovation, international collaboration and stronger access to global semiconductor markets.
The association discussed these priorities at its 2nd Annual General Meeting on Saturday, September 12, 2026, at Gulshan Club in Dhaka. BSIA President M. A. Jabbar chaired the meeting.
In his opening remarks, M. A. Jabbar reviewed the association’s major achievements over the past year and outlined its priorities for the future. He emphasized the need to develop a skilled semiconductor workforce, strengthen research and innovation, expand international collaboration and position Bangladesh as a competitive player in the global semiconductor industry.
The AGM discussed and deliberated on five agenda items: confirmation of the minutes of the 1st AGM held on September 13, 2025; consideration and adoption of the Annual Report 2025-2026; consideration and adoption of the association’s accounts and Auditor’s Report for FY 2025-26; appointment and remuneration of the auditor for FY 2026-27; and any other business.
BSIA Vice President (Finance) Mojahedul Haque Abul Hasanat presented the association’s accounts and Auditor’s Report for FY 2025-26. BSIA Director Munir Ahmed and Kamrul Ahsan Dewanjee also participated in the discussions.
Representatives of BSIA member companies—including Neural Semiconductor Limited, Ulkasemi Private Limited, iTest Bangladesh Limited, SILICONOVA Limited, Dynamic Solution Innovators, Tafuri Technologies Limited, BALU Technologies Ltd., Prime Silicon Technology Limited, CACTUS MATERIALS LTD, Kranti Associates Ltd., ACI Semiconductor Ltd., ADN Semiconductors Ltd. and Silicon Array—attended the AGM.
Members shared recommendations on semiconductor industry development, participation in major international semiconductor and technology events, exploration of global markets and preparation of a comprehensive Semiconductor Industry Roadmap toward 2030 for submission to the Government.
The discussions also emphasized stronger integration with international technology markets, investment in skilled talent and research capacity, and greater participation of Bangladesh in the global semiconductor supply chain.
The active participation and constructive contributions of BSIA members reflected a shared commitment to building a stronger, globally connected and competitive semiconductor ecosystem in Bangladesh.
//DBTech/HABC/SME/MIST//
