Silicon Synergy: Bangladesh–South Korea Signal Semiconductor Cooperation Surge

New prospects for cooperation in the semiconductor sector have emerged between Bangladesh and South Korea at the Global Semiconductor Roadshow organized by the Bangladesh Semiconductor Industry Association (BSIA) in Seoul, South Korea. During various meetings and events held on Tuesday, 12 May, emphasis was placed on talent development, advanced packaging, AI-based chip design, and international partnerships.

At the beginning of the roadshow, a meeting was held between the BSIA delegation and the Advanced Team of SK hynix. Discussions focused on semiconductor packaging, skilled workforce development, and the formation of a future ecosystem.

Subsequently, representatives from BSIA member companies—Dynamic Solutions Innovators (DSI), Prime Silicon Technology Ltd., Siliconova Limited, UlkaSemi Private Limited, and Neural Semiconductor Limited—held a meeting with the Korean semiconductor design house SuperGate. The discussions covered potential collaboration in semiconductor design, verification, embedded systems, AI-centric chip design, and engineering support.

In addition, a bilateral meeting with the Korea Semiconductor Industry Association (KSIA) highlighted the importance of forming a potential “15-country semiconductor alliance.” Discussions also included joint research, training, academic activities, and long-term industrial collaboration.
KSIA leaders praised Bangladesh’s young workforce, engineering capabilities, and emerging semiconductor ecosystem. They expressed the view that, with international collaboration and appropriate policy support, Bangladesh could potentially become the world’s 12th semiconductor hub in the future.

At the end of the day, a banquet reception was jointly organized by BSIA and the Embassy of Bangladesh in Seoul. Speeches were delivered by BSIA President M A Jabbar, Bangladesh Ambassador to South Korea Toufique Islam Shatil, and representatives of KSIA.

At the event, Dr. Muhammad Mostafa Hossain, in his presentation titled “Vision of Bangladesh for Semiconductor Packaging,” highlighted future prospects in advanced packaging, heterogeneous integration, and AI-driven semiconductor infrastructure.

DBTech/HA/EK/OR