Global semiconductor leader TSMC has announced plans to commence mass production of 1.6-nanometer chips starting next year. This year, the company is rolling out 2-nanometer chip production. According to reports from Phone Arena, the new 1.6-nanometer technology will increase transistor density, enabling faster and more efficient performance with reduced power consumption.
TSMC will incorporate the “Backside Power Delivery” (BPD) technology into its 1.6-nanometer chips, which will enhance power delivery systems. The company recorded a 37% increase in revenue during the last quarter and anticipates continued growth in the current year.
From the 90-nanometer chip in the 2007 iPhone to next year’s iPhone 17, which will feature a 3-nanometer chip, the evolution of Apple’s chip technology continues. Expectations are high for the iPhone 18, potentially launching in 2026 with 2-nanometer chips.
