Ten winners of the Huawei Seeds for the Future 2024 program from Bangladesh have embarked on a trip to China to participate in the regional phase of the competition. During the week-long program, they will attend the Digital Talent Summit and receive training on 5G, Artificial Intelligence (AI), Internet of Things (IoT), and Smart Cities in Nanning, Shenzhen, and Dongguan.
The Bangladeshi team includes Mohammad Fasiul Abedin Khan from the Electrical and Electronic Engineering (EEE) Department of BRAC University, Arpa Saha from the Computer Science and Engineering (CSE) Department of KUET, Sheikh Munkasir Ahmed Rafeed from the EEE Department of BUET, Mashfiha Mahi from the EEE Department of AUST, Maria Nawar from the CSE Department of AIUB, Samiha Masud from the Business Technology Management (BTM) Department of IUT, Tasfia Jannat Tasfi from the CSE Department of RUET, Avik Md. Imtiaz Arefin from the Mechatronics Engineering Department of RUET, Kazi Zarin Rahman from the Finance and Banking Department of BUP, and Raiyan Ibn Hossain from the EEE Department of IUT.
Tanvir Ahmed, Head of Media at Huawei South Asia, stated, “Huawei aims to empower the next generation of leaders to drive technological transformation and innovation in Bangladesh. For the past 11 years, Huawei has been offering this opportunity to Bangladeshi students through the Seeds for the Future program. We see that this initiative inspires students to think innovatively and bring forth new ideas. I am confident that the 10 students in the regional phase will gain the skills and knowledge needed to contribute to the country’s progress.”
This year, more than 1,850 students from Bangladesh applied for the competition. From these applicants, 50 were shortlisted for the evaluation and interview process for the preliminary round. Since its launch in Bangladesh in 2014, the competition has provided young people with insights into modern technologies and the opportunity to learn from experts. Globally, more than 15,000 students have benefited from the program.